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Manufacturer- Infrared radiation heats up quickly, reducing drying/curing time.
- Infrared's three key properties—penetration, reflection, and absorption—ensure excellent curing results for specific materials.
- No need to heat the entire space; only the wafer surface is heated, reducing energy consumption.
- Compared to traditional hot air drying, energy consumption can be reduced by 30%.
- Infrared penetrates materials for simultaneous internal and external heating, unlike hot air drying methods.
- Infrared wavelengths can be selected based on material properties to achieve optimal absorption.
- Low oxygen levels in a vacuum environment prevent wafer oxidation during high-temperature processes.
- Superior bubble removal performance compared to atmospheric hot air ovens.
- Multi-stage baking recipes and parameters with precise temperature and vacuum pressure control.
- 9-zone independent control system ensures uniform drying temperatures across all wafers.
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