we introduce laser film removal technology as a supporting process. By accurately controlling the laser’s energy, the system can remove coating layers that chemical etching cannot handle, improving overall process capability. With its high energy density and non-contact nature, laser removal allows for precise and selective cleaning on specific areas while keeping the removal results consistent and reliable.
In the wafer reclamation process, traditional film removal mainly relies on chemical etching to strip off coatings. However, as coating materials become more advanced, some now have very strong adhesion and high chemical resistance, making them difficult to remove using conventional chemical methods. This causes production bottlenecks and lowers wafer regeneration yield. To solve this problem, we introduce laser film removal technology as a supporting process. By accurately controlling the laser’s energy, the system can remove coating layers that chemical etching cannot handle, improving overall process capability. With its high energy density and non-contact nature, laser removal allows for precise and selective cleaning on specific areas while keeping the removal results consistent and reliable.
At the same time, with the growing global focus on ESG and sustainable development, manufacturers are under increasing pressure to reduce pollution and move toward greener production. Traditional chemical film removal not only uses large amounts of chemical agents and rinse water but also generates wastewater that needs complex treatment before discharge—raising both cost and environmental impact. In contrast, laser film removal is a dry, clean process that doesn’t require chemicals or wastewater treatment. It effectively reduces harmful emissions and energy use, supporting eco-friendly manufacturing goals.
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